Plating System—Ultra ECP 3d

For 3D TSV and 2.5D interposer applications

For 3d TSV and 2.5D interposer applications, copper metal plating is product-dependent and has a major impact on yield and reliability. Major process features include filling, plating rate, metal film thickness, thickness uniformity, overburden thickness, and protruding. Film properties such as defects and impurities are the key process indicators of the ECP process performance.

Building on our proven electrochemical plating (ECP) technology, the Ultra ECP 3d is configured with ACM’s exclusive Multi-Anode Partial Plating function, which allows the deposition of the copper metal layer on via structures of 3D TSVs and 2.5D interposers, and is compatible with aspect ratios of 10:1 and beyond.

ACM has numerous patents, awarded and pending, in many areas of plating technology—such as vacuum pre-wet, multizone anodes for superior uniformity control, rubber-seal plating chucks for superior sealing, partial pulse plating for pattern structure filling, etc.

Main Benefits

• Partial pulse plating technology
• Independent module design
• Compatible with high aspect ratio via
• High throughput and uptime
• Lower cost of consumables of cost of operation

Features & Specifications

• System for 300mm wafers
• Up to 3 load ports
• Up to 8 plating chambers
• Up to 2 cleaning chambers
• Up to 2 pre-wet chambers
• Plating uniformity: WIWNU < 3%
  WTWNU < 2%