Semiconductor Manufacturing
Discover How We Support IC Manufacturing
To accommodate the requirements of digital devices, you’re developing progressively faster, more powerful, smaller, and lower-cost semiconductors chips. You need process tools that help you achieve the finest feature geometries while also preventing the “killer defects” that reduce yields and, therefore, profit. At ACM Research, we’ve got the tools to support you.
Proprietary Cleaning and Deposition Processes
As logic and memory device technology nodes continue to shrink, we continually innovate proprietary solutions to address both your legacy and advanced technology requirements.
- Smart Megasonix™ combines jet spray with transient cavitation to gently remove stubborn particles from fragile IC circuitry
- Space Alternated Phase Shift (SAPS™) technology uses megasonic waves to remove random defects from flat and patterned wafers
- Timely Energized Bubble Oscillation (TEBO™) provides efficient, damage-free cleaning for both conventional 2D and 3D patterned wafers at advanced process nodes
- The Multi-Anode Partial Plating function in our ECP systems successfully deposits metal layers on dual damascene structures or through silicon vias
- Our Ultra Furnace platform addresses dry processing challenges of low-pressure chemical vapor deposition (LPCVD), atomic layer deposition (ALD), oxidation, and annealing
The bottom line: Our systems remove the tiniest particles and most stubborn residue and deposit ultra-thin, full-coverage films. They are designed to eliminate and prevent potential causes of defects from any wafer surface, regardless of topography.
Cleaning Systems—Ultra C SAPS
Learn MoreCleaning Systems—Ultra C TEBO
Learn MoreCleaning Systems—Ultra C Tahoe
Learn MoreCleaning Systems—Single Hot SPM
Learn MoreCleaning Systems—Bevel ETCH
Learn MoreCleaning Systems—Ultra C b
Learn MoreScrubber Systems—Ultra C s
Learn MoreCleaning Systems—Ultra C wb
Learn MorePlating System — Ultra ECP map
Learn MorePlating System—Ultra ECP 3d
Learn MoreFurnace Systems—Ultra Fn
Learn MoreFurnace Systems—Ultra FnA
Learn MoreFurnace Systems—Ultra FN Atmospheric Pressure Oxidation/Anneal
Learn MorePECVD Systems—Ultra Pmax™
Learn MoreTrack Systems—Ultra Lith Track
Learn MoreContact Us
We look forward to providing customized solutions for your wet wafer processing, ECP, Furnace, Track, PECVD, and SFP applications.