Panel Level Packaging—Ultra C bev-p tool

The Ultra C bev-p tool leverages our deep expertise in wet processing to deliver what we consider to be advanced performance. The first-of-its-kind tool is specifically designed for bevel etching and cleaning in copper-related processes and can handle both the front and back sides of panel bevel etching within a single system. This double-sided capability enhances process efficiency, yields, and product reliability in copper-related applications.

The Ultra C bev-p tool is a key enabler for fan-out panel-level packaging (FOPLP) processes, utilizing a wet etching technique designed specifically for bevel etching and copper residue removal. This process is crucial for preventing electrical shorts, minimizing contamination risks, maintaining the integrity of subsequent processing steps, and ensuring the long-term reliability of devices. At the core of the tool’s effectiveness is our patented technology that addresses the unique challenges posed by square panel substrates.

Unlike traditional round wafers, our innovative design ensures a precise bevel removal process that remains confined to the bevel region, even on warped panels. This advancement is vital for maintaining the integrity of the etching process and achieving the high performance and reliability required by advanced semiconductor technologies.

Major Benefits

• The Ultra C bev-p tool is designed specifically for panel substrates, offering compatibility with organic, glass, and bonding panels.
• The tool can handle panel warpages of up to 10 mm, ensuring optimal processing conditions.

Equipment Specifications

• The Ultra C bev-p efficiently manages both the front and back sides of panels, accommodating sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses ranging from 0.5 mm to 3 mm.
• It is designed with a mean time between failures (MTBF) of 500 hours and an uptime of 95%, ensuring exceptional reliability, consistent performance, and operational efficiency.
• It is equipped with a single robot and two load ports for secure and precise panel handling and transfer with panel breakage <1/50000.
• Capable of operating up to six processing chambers for copper and titanium, the Ultra C bev-p achieves a throughput of 40 panels per hour (PPH), making it highly efficient for high-volume production.

Process Indicators

• The system offers a bevel control accuracy of ±0.2 mm and an exclusive control range of 0–20 mm.
• It utilizes diluted sulfuric acid and peroxide (DSP)—a mixture of deionized (DI) water, sulfuric acid, and hydrogen peroxide—for effective copper removal. It also includes DI water for rinsing and nitrogen gas (N₂) for final drying, ensuring a clean and dry surface.