Plasma Enhanced CVD

Discover ACM’s PECVD Capabilities

When you’re depositing films for logic and memory devices, you want the best step coverage, high uniformity, and the ability to fine-tune material properties. Plasma-enhanced chemical vapor deposition (PECVD) allows you to do all that while maintaining low temperatures.

PECVD for 28nm and Above

You know mature node logic and memory devices are more in demand than ever. We think legacy node device manufacturing deserves best-in-class tools and processes. Our PECVD process tools are designed to meet your thick- and thin-film deposition needs. If you need very thin layers or fast process steps, we’ve got a system for that. If you need thicker films and longer process times, we deliver. All while optimizing throughput.

Our tools deliver liquid precursors directly to the chamber using a special vaporizer that doesn’t require carrier gas. Multiple heaters give you better control of your process and increase productivity. You’ll achieve better film uniformity, reduced film stress, and improved particle performance.