Track Systems—Ultra Lith Track

Leveraging coating and developing expertise

When you shift your logic and memory lithography processes to a track, the coating and developing steps are performed sequentially on one tool. By combining our core competencies in software and robotics with our proprietary coater and developer tool architecture. we’ve developed a tracktool that streamlines your processes, increases throughput, and improves yields at a low cost of ownership.

ACM’s Ultra Lith tool is a 300mm coater/developer tracktool that supports the photolithography process, ensuring ideal conditions for the entire process and optimizing the coating and developing steps before and after the wafer is exposed in a lithography tool. The Ultra Lith supports the full range of lithography applications, including i-line, KrF, and ArF processes.

Features and Benefits of the Ultra Lith

Designed to support 300mm wafers, this tool has multiple features that enhance performance across defectivity, throughput, and cost of ownership.

• Four 12-inch load ports
• Eight coating chambers
• Eight developing chambers
• 23°C ± 0.1 ℃ chamber temperature with a bake range of 50 ℃ to 250 ℃
• Wafer breakage of <1 per 50,000 wafers

The Ultra Lith delivers uniform air downflow, fast robot handling, and customizable software to address your specific requirements.